Friday 03 Dec 2004 2:00-3:00pm 4101 Etcheverry Hall University of California-Berkeley contact: johnv@eecs.berkeley.edu seminar list: http://ptsg.eecs.berkeley.edu/~johnv/seminar.html Effects of the secondary electron emission coefficient in RF oxygen discharge and Global model of oxygen discharges M. Roberto (ITA, S. Jose dos Campos, Brasil) Radio-frequency discharges in oxygen have a variety of applications for plasma processing such as etching and surface modifications. In order to investigate the structure of O2 RF discharges between parallel plates at 13.56 MHz we use the Particle-in-Cell plus Monte Carlo Collision Model. The discharge contains the elementary particles O2+, O- and electrons. A 500sinwt voltage is used for 20 and 200 mTorr pressure. The dominant process of generation of O- is the dissociative attachment, while the loss processes are electron impact detachment, mutual neutralization and detachment. For 20 mTorr process, O2+ and O- ions have a maximum density at the center and the electron density is two orders of magnitude less than that of these ions. However, at higher pressure, for 200 mTorr case, the charged density profiles become broader, compared to the 20 mTorr case. The influence of the secondary electron emission from the electrodes is also verified. There is a value of this coefficient (of approximately 0.4) for which the electron density has the same order of magnitude of O2+ density. A shape change of the electron energy distribution function for energies around 5 and 12 eV can be observed. Processes such as O2 ionization and dissociative attachment are responsible for this change. Bio: M. Roberto received the B.S. degree in physics from the Catholic University of S.Paulo, Brazil, the M.S. degree from the Space Research Institute, Brazil, and the Ph.D. degree in plasma physics from the Aeronautical Technological Institute (ITA), Brazil. She is currently an Associate Professor with the Physics Department, ITA, where one of her research interests is cold plasmas discharge simulation for application in deposition and etching processes. She also performs research in the area of nonlinear dynamics and chaos.